品牌:
Winbond Electronics (华邦电子股份)(1)
TI (德州仪器)(4)
Spansion (飞索半导体)(6)
Cypress Semiconductor (赛普拉斯)(9)
NXP (恩智浦)(11)
Rochester (罗切斯特)(1)
Integrated Circuit Systems(7)
Integrated Device Technology (艾迪悌)(3)
National Semiconductor (美国国家半导体)(2)
Silicon Labs (芯科)(8)
Toshiba (东芝)(1)
Microsemi (美高森美)(1)
AKM Semiconductor (旭化成)(1)
ADI (亚德诺)(1)
Fairchild (飞兆/仙童)(1)
Hittite(1)
Micrel (迈瑞)(8)
Microchip (微芯)(2)
Maxim Integrated (美信)(1)
多选
封装:
(69)
包装:
Tube(16)
(24)
Bulk(1)
Cut Tape (CT)(1)
Tape & Reel (TR)(18)
Tray(6)
Tape, Tape & Reel (TR)(2)
Tape(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料

©Copyright 2013-2026 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空